Technical Document
Specifications
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
4
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Mounting Type
Through Hole
Connector System
Wire to Board
Termination Method
Solder
Contact Plating
Tin
Series Number
55932
Current Rating
3.0A
Voltage Rating
250.0 V
Country of Origin
Japan
Product details
Single Row Vertical Header with Boss
A range of 2.00mm Pitch MicroClasp™ Wire-to-Board Headers with Boss.
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
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Technical Document
Specifications
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
4
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Mounting Type
Through Hole
Connector System
Wire to Board
Termination Method
Solder
Contact Plating
Tin
Series Number
55932
Current Rating
3.0A
Voltage Rating
250.0 V
Country of Origin
Japan
Product details
Single Row Vertical Header with Boss
A range of 2.00mm Pitch MicroClasp™ Wire-to-Board Headers with Boss.
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.