Winbond SLC NAND 2Gbit Quad-SPI Flash Memory 24-Pin TFBGA, W25M02GVTBIG

RS Stock No.: 188-2629Brand: WinbondManufacturers Part No.: W25M02GVTBIG
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Technical Document

Specifications

Brand

Winbond

Memory Size

2Gbit

Interface Type

Quad-SPI

Package Type

TFBGA

Pin Count

24

Organisation

256M x 8 bit

Mounting Type

Surface Mount

Cell Type

SLC NAND

Minimum Operating Supply Voltage

2.7 V

Maximum Operating Supply Voltage

3.6 V

Dimensions

8.1 x 6.1 x 0.85mm

Number of Words

256M

Minimum Operating Temperature

-40 °C

Number of Bits per Word

8bit

Maximum Operating Temperature

+85 °C

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P.O.A.

Winbond SLC NAND 2Gbit Quad-SPI Flash Memory 24-Pin TFBGA, W25M02GVTBIG
Select packaging type

Standard

Select packaging type

Standard - each

Available in multiples of 2.

Production -

Available in multiples of 2.

Recommended for ordering in large quantities. Items are packaged ready for insertion into machinery, allowing you to improve production efficiency.

2

Available in multiples of 2
2P.O.A.
4P.O.A.
6P.O.A.
8P.O.A.
10P.O.A.
12P.O.A.
14P.O.A.
16P.O.A.
18P.O.A.
20P.O.A.
22P.O.A.
24P.O.A.
26P.O.A.
28P.O.A.
30P.O.A.

P.O.A.

Winbond SLC NAND 2Gbit Quad-SPI Flash Memory 24-Pin TFBGA, W25M02GVTBIG
Stock information temporarily unavailable.
Select packaging type

Standard

Select packaging type

Standard - each

Available in multiples of 2.

Production -

Available in multiples of 2.

Recommended for ordering in large quantities. Items are packaged ready for insertion into machinery, allowing you to improve production efficiency.

2

Available in multiples of 2
2P.O.A.
4P.O.A.
6P.O.A.
8P.O.A.
10P.O.A.
12P.O.A.
14P.O.A.
16P.O.A.
18P.O.A.
20P.O.A.
22P.O.A.
24P.O.A.
26P.O.A.
28P.O.A.
30P.O.A.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Technical Document

Specifications

Brand

Winbond

Memory Size

2Gbit

Interface Type

Quad-SPI

Package Type

TFBGA

Pin Count

24

Organisation

256M x 8 bit

Mounting Type

Surface Mount

Cell Type

SLC NAND

Minimum Operating Supply Voltage

2.7 V

Maximum Operating Supply Voltage

3.6 V

Dimensions

8.1 x 6.1 x 0.85mm

Number of Words

256M

Minimum Operating Temperature

-40 °C

Number of Bits per Word

8bit

Maximum Operating Temperature

+85 °C

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more