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ITW Devcon Epoxy Putty, 500 g

RS Stock No.: 691-246Brand: ITW DevconManufacturers Part No.: 10211
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Technical Document

Specifications

Application

Filling, Support

Filler & Putty Type

Epoxy Putty

Filler Material

Steel

Product Form

Liquid

Package Type

Tub

Cure Time

16 h

Package Size

500 g

Maximum Operating Temperature

+121°C

Operating Temperature Range

Maximum of +121 °C

Country of Origin

Ireland

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P.O.A.

ITW Devcon Epoxy Putty, 500 g

P.O.A.

ITW Devcon Epoxy Putty, 500 g
Stock information temporarily unavailable.
You may be interested in
ITW Devcon Solid Adhesive, 500 g
P.O.A.Each (Exc. Vat)
ITW Devcon Epoxy Putty, 500 g
P.O.A.Each (Exc. Vat)
Epoxy adhesive metal set S2
P.O.A.Each (Exc. Vat)

Technical Document

Specifications

Application

Filling, Support

Filler & Putty Type

Epoxy Putty

Filler Material

Steel

Product Form

Liquid

Package Type

Tub

Cure Time

16 h

Package Size

500 g

Maximum Operating Temperature

+121°C

Operating Temperature Range

Maximum of +121 °C

Country of Origin

Ireland

You may be interested in
ITW Devcon Solid Adhesive, 500 g
P.O.A.Each (Exc. Vat)
ITW Devcon Epoxy Putty, 500 g
P.O.A.Each (Exc. Vat)
Epoxy adhesive metal set S2
P.O.A.Each (Exc. Vat)