Technical Document
Specifications
Brand
Syfer TechnologyCapacitance
100nF
Voltage
500V dc
Package/Case
1812 (4532M)
Mounting Type
Surface Mount
Dielectric
X7R
Tolerance
±10%
Dimensions
4.5 x 3.2 x 2.5mm
Length
4.5mm
Depth
3.2mm
Height
2.5mm
Series
Flexicap
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Product details
Syfer Flexicap 1812
FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs
A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish
FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors
An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking
FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
P.O.A.
Each (In a Pack of 2) (Exc. Vat)
Standard
2
P.O.A.
Each (In a Pack of 2) (Exc. Vat)
Standard
2
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Technical Document
Specifications
Brand
Syfer TechnologyCapacitance
100nF
Voltage
500V dc
Package/Case
1812 (4532M)
Mounting Type
Surface Mount
Dielectric
X7R
Tolerance
±10%
Dimensions
4.5 x 3.2 x 2.5mm
Length
4.5mm
Depth
3.2mm
Height
2.5mm
Series
Flexicap
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Product details
Syfer Flexicap 1812
FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs
A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish
FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors
An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking
FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes