Technical Document
Specifications
Brand
Fischer ElektronikFor Use With
Universal Square Alu
Length
10mm
Width
10mm
Height
10mm
Dimensions
10 x 10 x 10mm
Thermal Resistance
28.5K/W
Mounting
Conductive Foil
Colour
Black
Package Type
BGA
Material
Aluminium
Country of Origin
Germany
Product details
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
P.O.A.
1
P.O.A.
1
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Technical Document
Specifications
Brand
Fischer ElektronikFor Use With
Universal Square Alu
Length
10mm
Width
10mm
Height
10mm
Dimensions
10 x 10 x 10mm
Thermal Resistance
28.5K/W
Mounting
Conductive Foil
Colour
Black
Package Type
BGA
Material
Aluminium
Country of Origin
Germany
Product details
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).