Technical Document
Specifications
Brand
HiroseNumber of Contacts
30
Product Type
PCB Socket
Number of Rows
2
Pitch
0.5mm
Current
300mA
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
1.5mm
Connector System
Board-to-Board, Board-to-FPC
Voltage
50V
Series
DF23
Minimum Operating Temperature
-35°C
Row Pitch
4.4mm
Contact Gender
Female
Maximum Operating Temperature
85°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
Country of Origin
Japan
Product details
Hirose DF23 series
Hirose DF23 series 0.5mm Pitch Low-Profile Board-to-Board / Board-to-FPC Connectors
Features and Benefits
• 1.5 mm board-to-board distance
• Click sensation
• High contact reliability
• Large self-alignment
• Board placement with automatic equipment
Stock information temporarily unavailable.
P.O.A.
Each (In a Pack of 10) (Exc. Vat)
Standard
10
P.O.A.
Each (In a Pack of 10) (Exc. Vat)
Stock information temporarily unavailable.
Standard
10
Technical Document
Specifications
Brand
HiroseNumber of Contacts
30
Product Type
PCB Socket
Number of Rows
2
Pitch
0.5mm
Current
300mA
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
1.5mm
Connector System
Board-to-Board, Board-to-FPC
Voltage
50V
Series
DF23
Minimum Operating Temperature
-35°C
Row Pitch
4.4mm
Contact Gender
Female
Maximum Operating Temperature
85°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
Country of Origin
Japan
Product details
Hirose DF23 series
Hirose DF23 series 0.5mm Pitch Low-Profile Board-to-Board / Board-to-FPC Connectors
Features and Benefits
• 1.5 mm board-to-board distance
• Click sensation
• High contact reliability
• Large self-alignment
• Board placement with automatic equipment


