Technical Document
Specifications
Brand
LittelfuseDirection Type
Uni-Directional
Diode Configuration
Array
Maximum Clamping Voltage
30V
Minimum Breakdown Voltage
3.3V
Mounting Type
Surface Mount
Package Type
SOIC
Maximum Reverse Stand-off Voltage
3.3V
Pin Count
8
Peak Pulse Power Dissipation
2100W
Maximum Peak Pulse Current
75A
Number of Elements per Chip
5
Minimum Operating Temperature
-40 °C
Maximum Operating Temperature
+125 °C
Dimensions
5 x 4 x 1.65mm
Capacitance
8pF
Length
5mm
Height
1.65mm
Width
4mm
Test Current
2µA
Maximum Reverse Leakage Current
1µA
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P.O.A.
5
P.O.A.
5
Technical Document
Specifications
Brand
LittelfuseDirection Type
Uni-Directional
Diode Configuration
Array
Maximum Clamping Voltage
30V
Minimum Breakdown Voltage
3.3V
Mounting Type
Surface Mount
Package Type
SOIC
Maximum Reverse Stand-off Voltage
3.3V
Pin Count
8
Peak Pulse Power Dissipation
2100W
Maximum Peak Pulse Current
75A
Number of Elements per Chip
5
Minimum Operating Temperature
-40 °C
Maximum Operating Temperature
+125 °C
Dimensions
5 x 4 x 1.65mm
Capacitance
8pF
Length
5mm
Height
1.65mm
Width
4mm
Test Current
2µA
Maximum Reverse Leakage Current
1µA