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MBO Paste Lead Free Solder, 217°C Melting Point

RS Stock No.: 555-187Brand: MBOManufacturers Part No.: CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - POT DE 500G
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Technical Document

Specifications

Brand

MBO

Model Number

SIRIUS 1 LF

Percent Lead

0%

Product Form

Paste

Melting Point

217°C

Percent Silver

3%

Percent Tin

96.5%

Flux Type

Rosin

Product Weight

500g

Flux Content Percent

11.5%

Percent Copper

0.5%

Country of Origin

France

Product details

Sirius 1 LF solder paste Sn96.5 Ag3 Cu0.5

No-Clean solder paste suitable for stencil printing for reflow processes.
Fine pitch capability (400 μm).
High activity.
Minimal residue, neutral and colourless.
Chlorine-free.

Solder Paste - Lead Free

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P.O.A.

MBO Paste Lead Free Solder, 217°C Melting Point

1

Available in multiples of 1
1P.O.A.
2P.O.A.
3P.O.A.
4P.O.A.
5P.O.A.
6P.O.A.
7P.O.A.
8P.O.A.
9P.O.A.
10P.O.A.
11P.O.A.
12P.O.A.
13P.O.A.
14P.O.A.
15P.O.A.

P.O.A.

MBO Paste Lead Free Solder, 217°C Melting Point
Stock information temporarily unavailable.

1

Available in multiples of 1
1P.O.A.
2P.O.A.
3P.O.A.
4P.O.A.
5P.O.A.
6P.O.A.
7P.O.A.
8P.O.A.
9P.O.A.
10P.O.A.
11P.O.A.
12P.O.A.
13P.O.A.
14P.O.A.
15P.O.A.
You may be interested in

Technical Document

Specifications

Brand

MBO

Model Number

SIRIUS 1 LF

Percent Lead

0%

Product Form

Paste

Melting Point

217°C

Percent Silver

3%

Percent Tin

96.5%

Flux Type

Rosin

Product Weight

500g

Flux Content Percent

11.5%

Percent Copper

0.5%

Country of Origin

France

Product details

Sirius 1 LF solder paste Sn96.5 Ag3 Cu0.5

No-Clean solder paste suitable for stencil printing for reflow processes.
Fine pitch capability (400 μm).
High activity.
Minimal residue, neutral and colourless.
Chlorine-free.

Solder Paste - Lead Free

You may be interested in