Technical Document
Specifications
Brand
onsemiLogic Family
LCX
Mounting Type
Surface Mount
Package Type
TSSOP
Number of Elements per Chip
1
Output Type
3 State
Pin Count
20
Dimensions
6.6 x 4.5 x 1.05mm
Maximum Low Level Output Current
24mA
Maximum High Level Output Current
-24mA
Translation
Bi-Directional
Propagation Delay Test Condition
50pF
Maximum Propagation Delay Time @ Maximum CL
8 ns @ 50 pF
Maximum Operating Supply Voltage
2 to 3.6 V
Maximum Operating Temperature
+85 °C
Minimum Operating Supply Voltage
2 V
Minimum Operating Temperature
-40 °C
P.O.A.
Each (On a Reel of 2500) (Exc. Vat)
2500
P.O.A.
Each (On a Reel of 2500) (Exc. Vat)
2500
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Technical Document
Specifications
Brand
onsemiLogic Family
LCX
Mounting Type
Surface Mount
Package Type
TSSOP
Number of Elements per Chip
1
Output Type
3 State
Pin Count
20
Dimensions
6.6 x 4.5 x 1.05mm
Maximum Low Level Output Current
24mA
Maximum High Level Output Current
-24mA
Translation
Bi-Directional
Propagation Delay Test Condition
50pF
Maximum Propagation Delay Time @ Maximum CL
8 ns @ 50 pF
Maximum Operating Supply Voltage
2 to 3.6 V
Maximum Operating Temperature
+85 °C
Minimum Operating Supply Voltage
2 V
Minimum Operating Temperature
-40 °C