RS PRO Heatsink, Universal Rectangular Alu, 0.6°C/W, 150 x 100 x 15mm, PCB Mount

RS Stock No.: 903-3080Brand: RS PRO
brand-logo
View all in Heatsinks

Technical Document

Specifications

Brand

RS Pro

For Use With

Universal Rectangular Alu

Length

150mm

Width

100mm

Height

15mm

Dimensions

150 x 100 x 15mm

Thermal Resistance

0.6°C/W

Mounting

PCB Mount

Material

Aluminium

Application

High Power Semiconductor Device, Optoelectronic Device

Finish

Anodized

Country of Origin

United Kingdom

Product details

Heat Sink 109AB Series, 100mm Wide x 15mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.

Stock information temporarily unavailable.

Please check again later.

Stock information temporarily unavailable.

P.O.A.

RS PRO Heatsink, Universal Rectangular Alu, 0.6°C/W, 150 x 100 x 15mm, PCB Mount

P.O.A.

RS PRO Heatsink, Universal Rectangular Alu, 0.6°C/W, 150 x 100 x 15mm, PCB Mount
Stock information temporarily unavailable.

Technical Document

Specifications

Brand

RS Pro

For Use With

Universal Rectangular Alu

Length

150mm

Width

100mm

Height

15mm

Dimensions

150 x 100 x 15mm

Thermal Resistance

0.6°C/W

Mounting

PCB Mount

Material

Aluminium

Application

High Power Semiconductor Device, Optoelectronic Device

Finish

Anodized

Country of Origin

United Kingdom

Product details

Heat Sink 109AB Series, 100mm Wide x 15mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.