Technical Document
Specifications
Brand
Syfer TechnologyCapacitance
1nF
Voltage
4kV dc
Package/Case
2220 (5750M)
Mounting Type
Surface Mount
Dielectric
X7R
Tolerance
±5%
Dimensions
5.7 x 5 x 4.2mm
Length
5.7mm
Depth
5mm
Height
4.2mm
Series
Flexicap
Terminal Type
Surface Mount
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Country of Origin
United Kingdom
Product details
Syfer Flexicap 2220
FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs
A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish
FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors
An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking
FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
P.O.A.
Each (On a Reel of 500) (Exc. Vat)
500
P.O.A.
Each (On a Reel of 500) (Exc. Vat)
500
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Technical Document
Specifications
Brand
Syfer TechnologyCapacitance
1nF
Voltage
4kV dc
Package/Case
2220 (5750M)
Mounting Type
Surface Mount
Dielectric
X7R
Tolerance
±5%
Dimensions
5.7 x 5 x 4.2mm
Length
5.7mm
Depth
5mm
Height
4.2mm
Series
Flexicap
Terminal Type
Surface Mount
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Country of Origin
United Kingdom
Product details
Syfer Flexicap 2220
FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs
A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish
FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors
An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking
FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes