Technical Document
Specifications
Brand
WinbondMemory Size
32Mbit
Interface Type
SPI
Package Type
SOIC
Pin Count
8
Organisation
4M x 8
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
5.38mm
Height
1.91mm
Width
5.38mm
Dimensions
5.38 x 5.38 x 1.91mm
Series
W74M
Number of Words
4M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
7ns
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P.O.A.
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P.O.A.
90
Technical Document
Specifications
Brand
WinbondMemory Size
32Mbit
Interface Type
SPI
Package Type
SOIC
Pin Count
8
Organisation
4M x 8
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
5.38mm
Height
1.91mm
Width
5.38mm
Dimensions
5.38 x 5.38 x 1.91mm
Series
W74M
Number of Words
4M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
7ns