Winslow Straight Through Hole Mount 1.27 mm, 2.54 mm Pitch IC Socket Adapter, 8 Pin Female SOP to 8 Pin Male DIP

RS Stock No.: 158-2878Brand: WinslowManufacturers Part No.: W9501RC
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Technical Document

Specifications

Brand

Winslow

Pitch

1.27 mm, 2.54 mm

End 1

8 Pin Female SOP

End 2

8 Pin Male DIP

End 1 Number of Contacts

8

End 2 Number of Contacts

8

End 1 Type

SOP

End 2 Type

DIP

End 1 Gender

Female

End 2 Gender

Male

Mounting Type

Through Hole

Body Orientation

Straight

Contact Material

Brass

Contact Plating

Gold over Nickel

Housing Material

FR4

Country of Origin

United Kingdom

Product details

SOIC to DIP Sockets

Adaptics’ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.

PCB: Epoxy Fibreglass FR4

IC Sockets-Package Adaptics DIP

A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.

Stock information temporarily unavailable.

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P.O.A.

Winslow Straight Through Hole Mount 1.27 mm, 2.54 mm Pitch IC Socket Adapter, 8 Pin Female SOP to 8 Pin Male DIP

P.O.A.

Winslow Straight Through Hole Mount 1.27 mm, 2.54 mm Pitch IC Socket Adapter, 8 Pin Female SOP to 8 Pin Male DIP
Stock information temporarily unavailable.

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Technical Document

Specifications

Brand

Winslow

Pitch

1.27 mm, 2.54 mm

End 1

8 Pin Female SOP

End 2

8 Pin Male DIP

End 1 Number of Contacts

8

End 2 Number of Contacts

8

End 1 Type

SOP

End 2 Type

DIP

End 1 Gender

Female

End 2 Gender

Male

Mounting Type

Through Hole

Body Orientation

Straight

Contact Material

Brass

Contact Plating

Gold over Nickel

Housing Material

FR4

Country of Origin

United Kingdom

Product details

SOIC to DIP Sockets

Adaptics’ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.

PCB: Epoxy Fibreglass FR4

IC Sockets-Package Adaptics DIP

A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.