331041402053, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 4.1mm x 2mm x 5.3mm

RS Stock No.: 163-4369Brand: Wurth ElektronikManufacturers Part No.: 331041402053
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Technical Document

Specifications

Brand

Wurth Elektronik

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

5.3mm

Length

4.1mm

Width_SC_PC

2mm

Country of Origin

Korea, Republic Of

Product details

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.

Suitable for automated placement
Material: copper-beryllium (CuBe) gold-plated (Au)
Different types and sizes available
Corrossion-resistant
Wear-resistant
High temperatures and mechenical weight have no influence on the excellent connection properties
Reliable solderability

Stock information temporarily unavailable.

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Stock information temporarily unavailable.

P.O.A.

331041402053, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 4.1mm x 2mm x 5.3mm

1500

Available in multiples of 1
1500P.O.A.
3000P.O.A.
4500P.O.A.
6000P.O.A.
7500P.O.A.
9000P.O.A.
10500P.O.A.
12000P.O.A.
13500P.O.A.
15000P.O.A.
16500P.O.A.
18000P.O.A.
19500P.O.A.
21000P.O.A.
22500P.O.A.

P.O.A.

331041402053, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 4.1mm x 2mm x 5.3mm
Stock information temporarily unavailable.

1500

Available in multiples of 1
1500P.O.A.
3000P.O.A.
4500P.O.A.
6000P.O.A.
7500P.O.A.
9000P.O.A.
10500P.O.A.
12000P.O.A.
13500P.O.A.
15000P.O.A.
16500P.O.A.
18000P.O.A.
19500P.O.A.
21000P.O.A.
22500P.O.A.

Technical Document

Specifications

Brand

Wurth Elektronik

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

5.3mm

Length

4.1mm

Width_SC_PC

2mm

Country of Origin

Korea, Republic Of

Product details

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.

Suitable for automated placement
Material: copper-beryllium (CuBe) gold-plated (Au)
Different types and sizes available
Corrossion-resistant
Wear-resistant
High temperatures and mechenical weight have no influence on the excellent connection properties
Reliable solderability