Technical Documents
Specifications
Brand
MicrochipProduct Type
Microcontroller
Series
PIC XLP 16F
Package Type
DIP
Mount Type
Through Hole
Pin Count
20
Device Core
PIC
Data Bus Width
8bit
Program Memory Size
7kB
Maximum Clock Frequency
32MHz
Maximum Supply Voltage
5.5V
Number of Programmable I/Os
18
DACs
1 x 5 Bit
Minimum Operating Temperature
-40°C
Analogue Comparators
2
Maximum Operating Temperature
85°C
Standards/Approvals
REACH, RoHS3
Width
7.62mm
Minimum Supply Voltage
2.3V
Number of Timers
2
Instruction Set Architecture
Harvard
Automotive Standard
No
ADCs
17 x 10 Bit
Program Memory Type
FLASH
Product Details
The Microchip microcontroller features analog, core independent peripherals and communication peripherals, combined with eXtreme low power (XLP) technology for a wide range of general purpose and low power applications. The devices feature multiple PWMs, multiple communication, temperature sensor, and memory features like Memory Access Partition (MAP) to support customers in data protection and bootloader applications, and Device Information Area (DIA) which stores factory calibration values to help improve temperature sensor accuracy.
Stock information temporarily unavailable.
P.O.A.
Each (In a Tube of 22) (Exc. Vat)
22
P.O.A.
Each (In a Tube of 22) (Exc. Vat)
Stock information temporarily unavailable.
22
Technical Documents
Specifications
Brand
MicrochipProduct Type
Microcontroller
Series
PIC XLP 16F
Package Type
DIP
Mount Type
Through Hole
Pin Count
20
Device Core
PIC
Data Bus Width
8bit
Program Memory Size
7kB
Maximum Clock Frequency
32MHz
Maximum Supply Voltage
5.5V
Number of Programmable I/Os
18
DACs
1 x 5 Bit
Minimum Operating Temperature
-40°C
Analogue Comparators
2
Maximum Operating Temperature
85°C
Standards/Approvals
REACH, RoHS3
Width
7.62mm
Minimum Supply Voltage
2.3V
Number of Timers
2
Instruction Set Architecture
Harvard
Automotive Standard
No
ADCs
17 x 10 Bit
Program Memory Type
FLASH
Product Details
The Microchip microcontroller features analog, core independent peripherals and communication peripherals, combined with eXtreme low power (XLP) technology for a wide range of general purpose and low power applications. The devices feature multiple PWMs, multiple communication, temperature sensor, and memory features like Memory Access Partition (MAP) to support customers in data protection and bootloader applications, and Device Information Area (DIA) which stores factory calibration values to help improve temperature sensor accuracy.